Interconnection and packaging of solid-state circuitsPEDDER, D. J.IEEE journal of solid-state circuits. 1989, Vol 24, Num 3, pp 698-703, issn 0018-9200, 6 p.Article

A SYNTHESIS AND X-RAY STRUCTURE DETERMINATION OF THE PHOTOPRODUCTS OF A-HOMOCHOLESTAN-3-ONEAKIYAMA T; PEDDER D; SILVERTON JV et al.1975; J. ORG. CHEM.; U.S.A.; DA. 1975; VOL. 40; NO 25; PP. 3675-3680; BIBL. 21 REF.Article

Techniques for soldering surface mounted devices to printed circuit boards = Technique de brasage tendre de composants sur des cartes de circuits imprimésBRIERLEY, C. J; CONSIDINE, L; PEDDER, D. J et al.1984, Num 7, pp 25-30, issn 0263-0060Article

Microwave characterization of microstrip lines and spiral inductors in MCM-D technologyARNOLD, R. G; PEDDER, D. J.IEEE transactions on components, hybrids, and manufacturing technology. 1992, Vol 15, Num 6, pp 1038-1045, issn 0148-6411Article

Theoretical study of the limitation of frequency excursion in hysteresis-mode boost-converter input stages in high power-factor AC-fed power suppliesPEDDER, D. A. G; BROWN, A. D.IEE proceedings. Circuits, devices and systems. 2001, Vol 148, Num 4, pp 205-210, issn 1350-2409Article

A contactless electrical energy transmission systemPEDDER, D. A. G; BROWN, A. D; SKINNER, J. A et al.IEEE transactions on industrial electronics (1982). 1999, Vol 46, Num 1, pp 23-30, issn 0278-0046Article

An MCM single-ended downconverter for the DCS1800 mobile phone bandARNOLD, R. G; FAULKNER, C. C; PEDDER, D. J et al.SPIE proceedings series. 1999, pp 226-230, isbn 0-930815-57-2Conference Paper

Flip chip-bonded GaAs MMICs compatible with foundry manufactureWARNER, D. J; PICKERING, K. L; PEDDER, D. J et al.IEE proceedings. Part H. Microwaves, antennas and propagation. 1991, Vol 138, Num 1, pp 74-78, issn 0950-107X, 5 p.Article

Ion beam milling of pyroelectric ceramics for advanced thermal detector arraysBACHE, R. A. C; O'HARA, C; PARSONS, A. D et al.Journal of vacuum science and technology. A. Vacuum, surfaces, and films. 1989, Vol 7, Num 5, pp 2988-2991, issn 0734-2101, 4 p.Conference Paper